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Effect of Plasma Treatment Times on the Adhesion of Cu/Ni Thin Film to Polyimide
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우태규 Tae Gyu Woo , 박일송 Il Song Park , 정광희 Kwang Hee Jung , 전우용 Woo Yong Jeon , 설경원 Kyeong Won Seol |
KJMM 49(8) 657-663, 2011 |
ABSTRACT
This study represents the results of the peel strength and surface morphology according to the preprocessing times of polyimide (PI) in a Cu/Ni/PI structure flexible copper clad laminate production process based on the polyimide. Field emission scanning electron microscopy, X-ray diffraction, and X-ray photoelectron spectroscopywere used to analyze the surface morphology, crystal structure, and interface binding structure of sputtered Ni, Cu, and electrodeposited copper foil layers. The surface roughness of Ni, Cu deposition layers and the crystal structure of electrodeposited Cu layers were varied according to the preprocessing times. In the RF plasma times that were varied by 100-600 seconds in a preprocessing process, the preprocessing applied by about 300-400 seconds showed a homogeneous surface morphology in the metal layers and that also represented high peel strength for the polyimide. Considering the effect of peel strength on plastic deformation, preprocessing times can reasonably be at about 400 seconds.
keyword : electrical/electronic materials, surface modification, strength, scanning electron microscopy, SEM, flexible printed circuit
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Effect of Interfacial Reaction Layer on Mechanical Properties of 3-ply Mg/Al/STS Clad-metal
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김인규 In Kyu Kim , 송준영 Jun Young Song , 이영선 Young Sun Lee , 홍순익 Sun Ig Hong |
KJMM 49(8) 664-670, 2011 |
ABSTRACT
3-ply Mg/Al/STS clad-metal was fabricated by the roll bonding process. An interfacial reaction layer was formed at the Mg/Al interface at and above 300℃ whereas no interfacial reaction layer was observed up to 400℃. The effect of the interfacial reaction layer on the mechanical and fracture properties in clad metals after heat treatments were investigated The chemical compositions were analyzed at the Mg/Al interface by an Energy dispersive X-ray analysis (EDX). A tension test was performed to examine the interfacial cracking properties. The Mg layer fractured first, causing a sudden drop of the stress and Al/STS layer continued to deform until the final fracture. Periodic cracks and crack propagation was observed at the reaction layer between Mg and Al.
keyword : stainless steel, aluminum, magnesium, clad, interface properties, compound Layer, annealing
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