ABSTRACT
For LTCC substrate applications, glass-ceramic composites were produced with different glass- ceramic filler ratios. To maximize the signal speed, the composites were required to have a low dielectric constant and high thermal conductivity. To improve these properties, one approach is to add ceramic fillers with high thermal conductivity and electrical resistance to the glass matrix. We selected AlN filler due to its suitable thermal and electrical properties. With higher contents of AlN filler, the thermal conductivity of the composites increased. The increase in the thermal conductivity of the composites is attributed to the high thermal conductivity of AlN, due to which the heat dissipation network of the composite is enhanced. However, when the AlN filler content was more than 20 wt%, the thermal conductivity of the composites decreased due to the pore formation. The 20 wt% AlN sample showed the highest thermal conductivity and a relatively low dielectric constant.
keyword : composites, sintering, thermal conductivity, thermal analysis, LTCC
