발간논문

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In an attempt to develop a fluxless reflow solder bumping process, the effects of processing variables, which include energy input rate and time, and the shape of solder disk on the microstructure of the solder/Cu pad interface and the shear strength of the joints were investigated. It was demonstrated that a proper combination of the variables could lead to the formation of a spherical solder bump with shear strength comparable to that formed via the conventional reflow soldering process. In addition, the kinetics of Cu pad dissolution into the solder during laser heating was modeled numerically to elucidate intermetallic formation mechanism at the solder/Cu pad interface.

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The texture evolution during uniaxial tension in AA3003 sheet with inhomogeneous texture through thickness direction was investigated. To analyze the texture evolution, incomplete pole figures were measured and analyzed using WIMV method. After uniaxial tension along RD, copper, Goss, P, cube components increased and along TD, rotated copper, cube and Bs components increased. Texture evolved towards the $lt;100$gt; and $lt;111$gt; type fiber textures after uniaxial tensile deformation. The stable orientations during uniaxial tension could be predicted from the lattice rotation field with the rate sensitive model. Plastic strain ratio was measured and compared with the calculated value.

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