발간논문

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Vol.15, No.2, 131 ~ 140, 1977
Title
A Study of W - Cu Electrical Contact materials with Co Addition
문인형I . H . Moon, 이재성J . S . Lee
Abstract
An investigation has been performed to compare the effects of Co-and Ni-addition on the shrinkage behavior, the hardness, the contact resistance and the contact erosion of W-Cu contact materials in order to obtain a contact material of a lower contact resistance and higher arc resistance. For a smaller amount of liquid phase Co seems to be considerably more effective in promoting shrinkage than Ni, while for the higher Cu concentration the beneficial effect of both dopants is negligible. After the infiltration process the large volume shrinkage was found in all specimens and their densities were between 96% and 97% of the theoretical density. The hardness of W-Cu-Co alloy showed the higher value than that of W-Cu-Ni or that of simple W-Cu. The W-Cu-Co system showed much lower value of the contact resistance and the contact erosion than the other systems. Therefore Co can substitute for Ni in W-Cu-Ni electrical contact.
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