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Vol.20, No.7, 575 ~ 580, 1982
Title
Effects of Oxide Film on copper Powder on the Dimensional Change in Sintered Cu - 10w/o Sn Compacts
민경준Kyung Zoon Min, 이방식Bang Sik Lee, 이도재Doh Jae Lee
Abstract
The effect of heating rate and oxide film on copper surface on the dimensional change during sintering Cu-10% Sn compact and possible mechanism for the abnormal expansion near the peritectic temperature (798℃) are suggested. Two kinds of copper powders, reduced powder and oxidized powder, are used in this experiment in order to investigate the effect of oxide film on copper surface on the dimensional change of Cu-Sn transient liquid phase sintering. According to these experimental observation, the dimensional change is strongly depended upon the amount of localized tin-rich liquid phase during sintering. The more localized tin-rich liquid phase result in more dimensional expansion. In the case of specimen which is prepared with oxidized copper powder, the dimensional expansion is smaller than that of specimen prepared with reduced copper powders. It is apparent that the thin film of copper oxide on copper powder makes easy the flowing of tin-rich liquid through the interparticles of copper which may reduce the amount of localized tin-rich phase and resulted smaller dimensional expansion subsequently.
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