Morphological Stability of Solid - Liquid Interfaces of Al - Cu and Al - Ni Eutectic Alloys
장경욱Kyung Wook Jang, 이동희Dong Hi Lee
Abstract
The morphological changes in the solid-liquid interface and the microstructural development during unidirectional solidification of Al-Cu and Al-Ni eutectic alloys were investigated by the $quot;Peltier Interface Demarcation$quot;(PID) method in conjunction with theories of interface stability. PID method with the controlled current pulse was verified as a direct and precise technique to obtain fine details of the solid-liquid interface. The well-developed unidirectional microstructure maintaining $quot;planar interface$quot; was obtained at G₁/Y$gt;130℃ hr/㎝ and $gt;40℃ hr/㎝ for Al-Cu and Al-Ni eutectic alloy respectively. The breakdown of planar interface for Al-Ni eutectic alloy was resulted from the gradual amplification of the sinusoidal perturbation(λ=120㎛) as the growth rate increased, and the morphological stability was able to be predicted by Mullins-Sekerka theory. However, the growth rate of cellular structure development in Al-Cu system was observed to be somewhat slower than the value expected by the theory. This indicated that the different type of perturbations could be operative.