Modeling of Formation of Deposited layer by Plasma Spray Process
이주동Joo Dong Lee, 나형용Hyung Yong Ra, 홍경태kyung Tae Hong, 허성강Sung Kang Hur
Abstract
An analytical model is developed to describe the plasma deposition process in which average solidified thickness and coating and substrate temperatures are obtained. During deposition process solidification rate is periodically varied due to the impingement of liquid splats and the amount of liquid in the coating layer increases. Periodical variation of the solidification rate causes temperature fluctuation in coating and substrate. The nature of interfacial structure of plasma-sprayed NiCrBSi MA powder is compared with the result predicted using our model, which indicates that the liquid, which residue at the coating surface during deposition, causes discontinuous boundaries within the coating. And spraying rate and solidification rate are reverse periodically with spraying process.