발간논문

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Vol.33, No.1, 7 ~ 14, 1995
Title
Photoetching Application for Fuse Element Fabrication
윤정한 , 이홍로 J . H . Yoon H . r . Lee
Abstract
For fuse element fabrication with glass-ceramic substrate, photoetching technic was applied. To control copper layer thickness on glass-ceramic substrate, continuous electroless plating rates were monitored using QCM method. Plating rates were 0.6∼l㎛/hr, which value increased with Rochelle Salts addition. At 0.1%HF, 2min etching condition, adhesion between glass-ceramic and copper layer was most favorable. Etching factor value was most favorable at 1.8kgf/min injection pressure and 2.5M/L of etchant concentration. Fuse element design of stepped layer was a little effective for arc duration and preventing fuse temperature from rising suddenly.
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