| Ni was bonded by liquid phase diffusion using pure boron (B) as an insert material, and bonding mechanism and its application to other metals were studied. B powder, under 300 mesh, was coated on the polished bonding surface. Bonding specimen was packed in a quartz tube under 1.6×10^(-1) Pa vacuum atmosphere, and heated to 1433-1473K. As results, at the bonding temperature of 1433K, 1453K and 1473K, initial width of liquid layer was 87 ㎛, 81 ㎛, 80 ㎛, and maximum width of liquid layer was 138 ㎛, 146 ㎛ and 158 ㎛ respectively with the thickness of insert material of 25 ㎛. Bonding mechanism was similar to conventional TLP bonding except the formation of liquid metal on the joint and initial width of liquid layer. Other metals such as Cu, AISI304 steel, Alloy713C and Rene80 superalloy were also liquid phase diffusion bonded by using pure B. |
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