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Vol.38, No.11, 1452 ~ 1457, 2000
Title
A Study on the Static Creep Behavior of 55Cu-Ni Solid Solution Alloy at 0.4 Tm
김택수Taek Soo Kim,박용권Yong Kwon Park,최재하Jae Ha Choi,천병선Byong Sun Chun
Abstract
The steady-static creep behavior of Cu-45Ni alloy has been investigated over the temperature range of 673-703K (0.43-0.44Tm) and the stress levels of 40-45 ㎏/㎟. Constant stress creep tests were carried out in the experiment. Measured stress exponents, n, of the alloy obtained during the creep deformation under the given conditions were 5.54, 5.28, 5.14, and 4.96 at the temperatures of 673, 683, 693 and 703K, respectively. The activation energy, Qc, was measured to be 44.93, 43.78, 43.31 and 42.74 ㎉/mole through the stress ranges of 40.0, 42.0, 43.5 and 45 ㎏/㎟, respectively. Lason-Miller parameter(P) determined from the crept specimen of Cu-45Ni solid solution alloy could be described as (T + 460)(21 + log t_r), where T is absolute temperature and t_r is fracture time. Empirically determined static creep rate was investigated. Cu-Ni system was classified as group II solid solution and dominated by intergranular type fracture with dimples.
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