발간논문

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Vol.38, No.11, 1528 ~ 1535, 2000
Title
Analysis of Temperature Distribution in Solder Bumps during Laser Fluxless Solder Bumping
이종현Jong Hyun Lee,조윤원Yun Won Cho,채수원Soo Won Chae,김용석Yong Seog Kim
Abstract
During the fluxless solder bumping by the radiation of CO₂ laser, temperature distribution in the solder bump was modeled by finite element method(FEM) with energy input rate and heating time as variables. The peak temperatures at the interface between solder and pre-tinned Cu pad were calculated and compared with experimental data. When Gaussian intensity distribution of laser beam was assumed in the axisymmetric coordinates, the calculated and measured temperature profiles were similar to each other. It was demonstrated experimentally and theoretically that the reaction layer at the interface could change from Cu_6Sn_5(η-phase) to Cu₃Sn(ε-phase) as a function of energy input rate and heating time during the reflow solder bumping.
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