발간논문

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Vol.39, No.10, 1101 ~ 1108, 2001
Title
Mechanical Behaviors : Evaluation of Thin Film residual Stress through the Nanoindentation Technique and the Modeling of Stress Relaxation
이윤희Yun Hee Lee,최열Yeol Choi,권동일Dong Il Kwon
Abstract
Residual stress in thin film was evaluated by a nanoindentation technique combined with a new stressrelaxation model. The dominant shape change in the nanoindentation curve during the stress relief in thin film was identified as the increase or decrease of applied load for a given maximum indentation depth. The applied indentation load of film under tensile stress was higher than that of stress-free film. Also, a stress-sensitive deformation morphology around the indenter-thin film contact was proposed. Finally, the in-plane residual stress in thin film was directly calculated from the change in the normal applied load arising from stress relaxation. The stresses for diamond-like carbon (DLC) and Au films evaluated under the proposed analytical model agreed well with the residual stresses measured by the conventional curvature method.
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