| Abstract |
| A free-standing tungsten/copper composite plate, which may be used as heat sink material for electronic packaging, was produced with air plasma spray by using spherically agglomerated W/Cu composite powder. The model for particle vaporization process was studied to predict the particle behavior in the high temperature of plasma jet. At the surface of the deposit layer, copper became oxidized to cuprite (Cu₂O). The degree of oxidation decreased towards the interface between deposit and substrate. Almost no Cu₂O was detected at the inner layer after grinding off 70 ㎛ from the surface. Most pores were found in the vicinity of tungsten-rich region. The microstructures of W/ Cu deposits were also discussed. |
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| Key Words |
| Plasma spray, Tungsten/copper composite, Deposit, Heat sink |
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