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Vol.43, No.3, 248 ~ 255, 2005
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| Title |
| Effect of Bonding Stress on the Contact Resistance of the Sn/Ag Bump for Chip-on-Glass Bonding Using Non-conductive Adhesive |
| 이광용 Kwang Yong Lee , 이윤희 Yoon Hee Lee , 김영호 Young Ho Kim , 오태성 Tae Sung Oh |
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| Abstract |
| Chip-on-glass bonding using nonconductive adhesive was accomplished with joining of the Sn/Ag bumps, and the average contact resistance of the Sn/Ag bump was measured with variation of the bonding stress. Average contact resistance of the Sn/Ag bump could be obtained from the slope of the curve for daisy chain resistance vs. number of Sn/Ag bumps. With increasing the bonding stress from 31.8 MPa to 69.8 MPa, the average contact resistance decreased from 30 mil/bump to 15.6 mΩ/bump. With further increasing the bonding stress above 69.8 MPa, however, the average contact resistance changed little within the range of 12.9-15.6 mil/bump. Among the factors affecting the contact resistance with variation of the bonding stress, plastic deformation of the Sn/Ag bump had larger effect than the amount of the microvoids remaining at the contact interface between Sn/Ag bumps. (Received November 22, 2004) |
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| Key Words |
| Electronic packaging, Chip on glass, Flip chip, Sn Bump, Contact resistance |
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