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Vol.44, No.10, 670 ~ 678, 2006
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| Title |
| Tensile Behavior of Commercial Copper and Copper Alloys Processed by Accumulative Roll-Bonding (ARB) |
| 장영환 Young Hwan Jang , 김상식 Sang Shik Kim , 이성희 Seong Hee Lee , 한승전 Seung Zeon Han , 임차용 Cha Yong Lim , 김창주 Chang Joo Kim , Masahiro Goto |
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| Abstract |
| The effect of trace elements on tensile behavior of ARB (accumulative roll-bonding) processed commercially pure copper products with nano grain size was examined. The trace elements in commercially pure copper substantially affected dynamic recovery behavior during ARB process, and eventually tensile behavior of pure copper. Various copper products, including OFC (oxygen-free copper), DLP (deoxidized low-phosphorous copper), PMC90 (Cu-0.15Fe-0.02P) and C194 (Cu-2.4Fe-0.02P), were used for 2-layer ARB process. Only PMC90 alloy was used for 3-layer ARB process. The increase in tensile strength for 2-layer ARBed OFC and PMC90 tended to saturate after three ARB process cycles. For DLP, on the other hand, the tensile strength continuously increased with increasing ARB process up to eight cycles. For 3-layer ARBed PMC90, the tensile strength also increased with equivalent strain up to a strain of~5.1. The effect of trace elements on the tensile behavior of ARBed commercially available copper products was discussed based on the thermal analysis, micrographic and fractographic observation. |
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| Key Words |
| accumulative roll-bonding, ARB, tensile behavior, dynamic recovery, pure copper, trace element |
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