| Abstract |
| The elastic modulus of copper thin film with various thicknesses has been analyzed using nanoindentation and micro-cantilever beam bending tests. The specimens were fabricated by electroplating and silicon bulk micromachining processes. The elastic modulus measured by nanoindentation were 112 GPa for 3.0 mm thick and 99 GPa for 12 μm thick. The micro-cantilever beam bending test was conducted to measure the modulus and its result were 121 GPa for 2.8 μm thick and 99 GPa for 10.5 mm thick. The texture of copper thin films was measured quantitatively from the orientation distribution function by pole-figure technique. The calculated modului were 115 GPa for 3 μm thick and 102 GPa for 12 μm thick. Such theoretical estimations based on the texture analysis showed a good agreement with experimental measurements. Therefore, we demonstrated that the elastic modulus of electroplated copper thin films was influenced by the variation of preferred orientation of the films. |
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| Key Words |
| nanoindentation test, micro-cantilever beam bending test, elastic modulus, texture, orientation distribution function |
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