| Abstract |
| Copper coating was deposited by cold spraying and especially two kinds of powders with different particle size (powder A: 9~53μm, powder B: 4~23μm) were used for the spraying. Annealing heat treatment was also applied to the coating to examine its effect on the microstructure and properties of the cold-sprayed copper coating. It was found that the use of fine powder could decrease the surface roughness and porosity of coating layer. After annealing, the micro-hardness of the cold-sprayed copper coating decreased significantly with increasing annealing temperature. The examination of coating microstructure evidently revealed that coating was constituted by the elongated particles and interfaces were clearly observed between the deposited particles. Annealing treatment led to the recovery and the evident recrystallization of deformed grains and the remarkable grain growth as well. The abrupt decrease in hardness was mainly attributed to recrystallization. The electrical conductivity and thermal conductivity of powder B coating were higher those of powder A. It was also apparent that the electrical and thermal conductivities of cold-sprayed copper coating could be improved through annealing treatment. |
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| Key Words |
| cold spraying, copper (Cu) coating, particle size, annealing heat treatment, porosity, micro-hardness, electrical resistivity, thermal conductivity |
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