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Vol.47, No.9, 586 ~ 591, 2009
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| Title |
| Effect of Additives on the Physical Properties and Surface Morphology of Copper Foil |
| 우태규 Tae Gyu Woo , 박일송 Il Song Park , 박은광 Eun Kwang Park , 정광희 Kwang Hee Jung , 이현우 Hyun Woo Lee , 설경원 Kyeong Won Seol |
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| Abstract |
| The effects of additives on the surface morphology and physical properties of copper electrodeposited on polyimide(PI) film were investigated here. Two kinds of additives, an activator(additive A) and a leveler(additive B), were used in this study. Electrochemical experiments, in conjunction with scanning electron microscopy(SEM), X-ray diffraction(XRD) and a four-point probe, were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the presence of the additives. The surface roughness, crystal growth orientation and resistivity could be controlled using various quantities of additive B. High resistivity and lower peel strength were observed on the surface of the copper layer electroplated onto the electrolyte with no additive B. However, a uniform surface, lower resistivity and high flexibility were obtained with a combination of 20 ppm of additive A and 100 ppm of additive B. |
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| Key Words |
| additive, plating, peel strength, resistivity, flexibility |
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