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Vol.48, No.12, 1116 ~ 1123, 2010
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| Title |
| Measurement of Adhesion Strength and Nanoindentation of Metal Interconnections of AI/Ni and TiW/Ni Layers Formed on Glass Substrate |
| 조철민 Chul Min Joe , 김재호 Jae Ho Kim , 황소리 So Ri Hwang , 윤여현 Yeo Hyeon Yun , 오용준 Yong Jun Oh |
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| Abstract |
| Metal interconnections of multilayer Al/Ni and TiW/seed-Ni/Ni were formed on glass, and the adhesion strength and nanoindentation response of the composite layers were evaluated. The Al/Ni multilayer was formed by an anodic bonding of glass to Al and subsequent electroless plating of Ni, while the TiW/Ni multilayer was fabricated by sputter deposition of TiW and seed-Ni onto glass and electroless plating of Ni. Because of the diffusion of aluminum into glass during the anodic bonding, anodically bonded glass/Al joint exhibited greater interfacial strength than the sputtered glass/TiW one. The Al/Ni on glass also showed excellent resistance against delamination by bending deformation compared to the TiW/seed-Ni/Ni on glass. From the nanoindentation experiment of each metal layer on glass, it was found that the aluminum layer had extremely low hardness and elastic modulus similar to the glass substrate and played a beneficial role in the delamination resistance by lessening stress intensification at the joint. The indentation data of the multilayers also supported superior joint reliability of the Al/Ni to glass compared to that of the TiW/seed-Ni/Ni to glass. |
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| Key Words |
| Thin films, sputtering, interfaces, indentation, anodic bonding |
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