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Vol.50, No.4, 316 ~ 324, 2012
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| Title |
| Effect of Post Heat Treatment Temperature on Interface Diffusion Layer and Bonding Force in Roll Cladded Ti/Mild steel/Ti Material |
| 이상목 Sang Mok Lee , 김수민 Su Min Kim , 위세나 Se Na We , 배동현 Dong Hyun Bae , 이근안 Geun An Lee , 이종섭 Jong Sup Lee , 김용배 Yong Bae Kim , 배동수 Dong Su Bae |
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| Abstract |
| The aim of this study is to investigate the effect of post heat treatment on bonding properties of roll cladded Ti/MS/Ti materials. First grade Ti sheets and SPCC mild steel sheets were prepared and then Ti/MS/Ti clad materials were fabricated by a cold rolling and post heat treatment process. Microstructure and point analysis of the Ti/MS interfaces were performed using the SEM and EDX Analyser. Diffusion bonding was observed at the interfaces of Ti/MS. The thickness of the diffusion layer increased with post heat treatment temperature and the diffusion layer was verified as having (ε+ζ)+(ζ+β-Ti) intermetallic compounds at 700℃ and an (ζ+β-Ti) intermetallic compound at 800℃, respectively. The micro Knoop hardness of mild steel decreased with post heat treatment temperature; however, those of Ti decreased at a range of 500~600 ℃ and showed a uniform value until 800℃ and then increased rapidly up to 900℃. The micro Knoop hardness value of the diffusion layer increased up to 700℃ and then saturated with post heat treatment. A T-type peel test was used to estimate the bonding forces of Ti/Mild steel interfaces. The bonding forces decreased up to 800℃ and then increased slightly with post heat treatment. The optimized temperature ranges for post heat treatment were 500~600℃ to obtain the proper formability for an additional plastic deformation process. |
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| Key Words |
| Ti/Mild steel/Ti clad material, post heat treatment, bonding interface property, intermetallic compound, diffusion Layer, bonding force |
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